Semiconductor device



FIG. 1 is a front perspective view of a semiconductor device, showingour new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a top plan view thereof; a bottom plan view being a mirrorimage thereof;

FIG. 4 is a right side elevational view thereof; a left side elevationalview being a mirror image thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a front perspective view of a second embodiment of asemiconductor device, showing our new design;

FIG. 8 is a rear perspective view thereof;

FIG. 9 is a top plan view thereof; a bottom plan view being a mirrorimage thereof;

FIG. 10 is a right side elevational view thereof; a left sideelevational view being a mirror image thereof;

FIG. 11 is a front elevational view thereof; and,

FIG. 12 is a rear elevational view thereof.

The ornamental design for a semiconductor device, as shown anddescribed.